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Intel Plans Carrier-Grade Server Products for Telecommunications Industry
URL(s): developer.intel.com
AMSTERDAM, The Netherlands, May 17, 2001--In his keynote at the
Intel Developer Forum today, Intel Corporation Vice President Mike Fister said the company plans to
introduce a family of carrier-grade, Intel-based server products for the telecommunications industry by
the end of this year. The Intel(R) Architecture, carrier-grade server products will deliver world-class
performance, reliability and scalability at lower costs from a choice of manufacturers versus today's
proprietary telecommunication offerings.
The new product family will initially include Intel Pentium(R) III processor-based systems in
high-density form factors, with carrier-grade servers based on the Intel Xeon(TM) and Itanium(TM)
processor families further in the future. Carrier-grade servers comply with telecommunications industry
requirements for platform ruggedness to survive environmental hazards such as excessive heat and
cold, fires and earthquakes.
"Today's announcement marks the next step for Intel-based servers as we introduce value and top
performance to a very specific segment in the server market," said Mike Fister, vice president and
general manager of Intel's Enterprise Platforms Group. "Intel-based servers will offer
telecommunication customers choice, scalability, reliability and top performance -- all at affordable
prices -- when compared to RISC-based vendors."
Intel will sell its new server product lines to Original Equipment Manufacturers (OEMs) and
Telecommunication Equipment Manufacturers (TEMs). Intel's telecommunications products will be
carrier-grade quality and thus compliant with stringent telecommunication standards including Network
Equipment Building Speciation (NEBS) in the United States and European Telecom Standards
Institute (ETSI) in Europe.
Intel expects to introduce processors, chipsets and boards for inclusion in two types carrier-grade
servers based on the Pentium III processor. The first will be in a 1U-sized dual processor server line
(1U is a unit of measurement of 1.75 inches). The second will be produced in a 2U form factor.
These Intel-based systems will power core telecom, wireless and communication network
infrastructures for use in converged high-speed, high-traffic networks used by telecommunication
companies, telecom service providers and large corporations. The platforms will run a wide range of
wireline and wireless applications, including software-enabled switches (soft switches), adjunct
services, location-based wireless services and wireless infrastructure supporting the 2.5 and 3G
technologies, virtual private networks, content delivery services, carrier-grade web and application
hosting, unified messaging services and call centers.
Working closely with key telecommunication and computing companies, Intel is optimizing solutions
and middleware for these platforms in the areas of converged services, operating system support,
operations administration, and maintenance and network infrastructure.
Intel Developer Forum is a worldwide program that gives developers technical information and
vision to help them create innovative products for the Internet economy. The 2001 Spring IDF
conferences, held earlier this year in San Jose, Tokyo, Taipei and Beijing and now Amsterdam, feature
a full schedule of sessions and hands-on labs, along with numerous demonstrations of cutting-edge
products and technologies. Industry participants include software and hardware developers of PC and
handheld clients, servers and communications equipment. For more on semi-annual conferences held
in the United States, Asia and Europe, visit http://developer.intel.com/idf. For the latest information on
technology developments throughout the year, visit Intel Developer Update at
http://developer.intel.com/update.
Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and
communications products. Additional information about Intel is available at www.intel.com/pressroom.
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