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SILICON WAVE ANNOUNCES SECOND GENERATION BLUETOOTHT WIRELESS SOLUTIONS
URL(s): www.siliconwave.com
Silicon Wave Connected Solutions Program, Development Tools and Baseband IP
Licensing Program, Combined with Second Generation Components, Extend the
Company's Leadership in Worldwide Bluetooth Marketplace
San Diego - October 29, 2001 - Silicon Wave, Inc., a leading designer and
provider of RF communication system components, today announced their second
generation Bluetooth components along with their Silicon Wave Connected
Solutions Program, development tools and Baseband IP Licensing Program.
Building on the strengths of their industry-leading first generation
products, which have been shipping in volume since 2000, this second
generation includes the SiW1701T Radio Modem and the SiW1750T and SiW1760T
Baseband Processors. All of the ICs were designed to significantly reduce
power consumption, system cost and size, while allowing maximum flexibility
for implementing end-user products. The Silicon Wave Connected Solutions
Program provides worldwide support for customers to rapidly develop complete
Bluetooth solutions based on proven technology from Silicon Wave and other
vendors of complementary Bluetooth products. Silicon Wave's enhanced
development tools include a wireless development system and a radio modem
evaluation system. In addition, Silicon Wave's Baseband IP Licensing
Program provides customers with a fast path to integrating Bluetooth
baseband functionality into their system-on-chip ASIC designs.
"Low power consumption and solution cost will continue to be the primary
selection criteria for Bluetooth chips," said Joyce Putscher, director of
converging markets and technologies for Cahners In-Stat Group.
"Semiconductor designers, who are successful in delivering the lowest power
possible while developing programs to assist in implementing low power
products within a short time-to-market at a low Bill of Material (BOM) rate,
will experience the most success as OEMs strive to preserve margins in this
thriving market."
Compared to Silicon Wave's first generation products, the second generation
products decrease power consumption by up to 90%, system cost by 30% and
size by 60%. To ensure the lowest power Bluetooth solutions, Silicon Wave
implemented the baseband ICs in 0.18um technology, lowered the internal
voltage to 1.8V and enhanced the system level architecture for Bluetooth
performance tasks. This yields a much lower count and cost of external
components, significantly lowering the total Bluetooth BOM cost. The
footprint of Silicon Wave's radio modem and baseband has decreased to better
fit small form factor mobile applications without losing any performance
capabilities.
"Our second generation is designed to meet OEM and end-user requirements for
lower power, lower cost and smaller size solutions," said Dave Lyon, CEO of
Silicon Wave. "One solution does not fit all, and we anticipate that our
SiW1700 series, combined with our Silicon Wave Connected Solutions Program,
development tools and Baseband IP Licensing Program, will benefit our
customers directly by providing maximum flexibility, and the shortest
time-to-market."
The Silicon Wave Connected Solutions Program is a comprehensive approach
created to provide customers with the resources needed to rapidly develop
complete Bluetooth solutions based on proven technology from Silicon Wave
and other companies with complementary Bluetooth products. Through
relationships with these other companies, including authorized design
centers, module suppliers and upper layer protocol software suppliers,
Silicon Wave has developed a worldwide support structure that ensures rapid
time-to-market for customers who have selected Silicon Wave solutions.
Silicon Wave's development tools, the wireless development system (WDS4) and
radio modem evaluation system (RMES4), provide a flexible Bluetooth
environment to facilitate radio development and performance testing.
Silicon Wave's Baseband IP Licensing Program offers a robust Bluetooth
baseband to OEMs, making a $5 Bluetooth solution a reality by enabling the
integration of Bluetooth baseband functionality into the OEM's
system-on-chip ASIC designs. This baseband design supports ARMT processors
and utilizes a highly compact software stack requiring only 12KB RAM and 3
MIPS with a host processor.
"Silicon Wave's second generation product portfolio, combined with our
Connected Solutions Program, delivers optimal performance and compatibility
with the smallest footprint," said Steve Brown, vice president and general
manager of Bluetooth Products for Silicon Wave. "When coupled with our
Baseband IP Licensing Program, the SiW1701 Radio Modem results in the world'
s smallest Bluetooth implementation at 7x7 mm, further building on Silicon
Wave's dedication to providing lower power, lower cost and a smaller
footprint without sacrificing high performance or data throughput."
This portfolio of products is targeted for integration into mobile phones,
notebook and desktop PCs and accessories, printers and PDAs. All components
are compatible with Silicon Wave's first generation components and are
Bluetooth Specification Version 1.1 compliant.
SiW1701 Radio Modem
The SiW1701 builds on the features of the industry-leading SiW1502T radio
modem. Encompassing the same high-performance capabilities as the SiW1502,
the SiW1701 is fully integrated, has ultra-low standby and active power
consumption, and functions with superior RF performance over an extended
temperature range, ideal for mobile phone applications. The SiW1701
features a 100% digital interface. Packaged in a 48-pin MLF with a 7x7 mm
footprint, samples of the SiW1701 are currently available with volume
production planned in Q1 of 2002. The SiW1701 is priced at $5 when
purchased in 100k unit quantities.
SiW1750 and SiW1760 Baseband Processors
The SiW1750 and SiW1760 are unique 32-bit ARM-based baseband processors that
work with the SiW1701 at an unprecedented level of low power consumption and
allow maximum data throughput for interoperability and connectivity to a
number of devices. The SiW1750 uses external flash memory - giving maximum
application flexibility. The SiW1760 integrates ROM to provide a low cost,
low power solution in a smaller footprint. These baseband processors
integrate the industry-standard ARM 7 processor core and are customized for
use in battery powered mobile applications. The SiW1750 is packaged in a
132-pin BGA with a 8x8 mm footprint. Samples of the SiW1750 will be
available in Q4 of 2001 and volume production is planned in Q1 2002. The
SiW1760 is packaged in a 64-pin BGA with a 6x6 mm footprint. Samples will
be available and volume production is planned for Q2 of 2002. Both the
SiW1750 and SiW1760 are priced at $5 each when purchased in 100k unit
quantities.
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