|
Newsletters
|
|
|
|
|
Wireless Developer Network - Daily News
Visit the WirelessDevNet Symbian DevZone
Today's News |
Yesterday's News |
Submit News |
News-"wireless" Top Stories! |
Around-The-Web
| Wireless DevZones!
Atmel Launches Extra-Small Silicon Germanium Power Amplifier Modules for CDMA/ AMPS/ PCS Mobile Phones
Heilbronn, Germany - September 27th, 2002 - AtmelŪ Corporation
(Nasdaq: ATML) announced today the availability of two new Power
Amplifier (PA) modules for the fast growing CDMA phone markets in the
United States, Korea, South America and China. The new module T0372
targets the cellular band with both modes CDMA/ AMPS, whereas the T0377
covers the PCS (US) band. Both modules are housed in a very small
10-pin, 4 x 4 mm package which is ideal for the new generation of small,
light phones. Improved RF performance is made possible by utilizing
Atmel's leading edge Silicon-Germanium (SiGe) semiconductor process. The
quiescent current control is compatible to today's given industry
standard. These power amplifier modules are further new devices of the
CDMA product series being developed as part of the CDMA345TM joint
development project with TriQuint Semiconductor.
The PAs' excellent RF performance meets the requirements of the IS-95/98
standards and is also compatible to the CDMA2000 (1 x RTT, see footnote)
requirements. The parts can operate in one, two or continuous bias
modes, which provides the flexibility to minimize the average current
consumption through digital or analog control.
The new modules T0372 and T0377 can be easily designed into phone
platforms as they require few external components and incorporate a
CMOS-compatible logic interface as well as an internally matched input
and output (50 ohm RF impedance). In digital control mode, the devices
allow to be interfaced directly with low-voltage CMOS microprocessors
without the need for additional circuitry required today by many
competing solutions.
"These new power amplifiers T0372 and T0377 simplify significantly
design-in due to their simple, low-cost construction process and low
overall parts count," stated Uwe Barthelmes, Marketing Director for
Communications Products at Atmel.
Samples of the T0372 and the T0377 in 4 x 4 mm lead frame outline
packages with 10 pins and evaluation boards are available now.
|
|
|
|
