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QUALCOMM Announces RTR6250 Multiband UMTS/GSM RF Chip to Enable Worldwide Roaming for UMTS Terminals
Latest radioOne Chip Adds GSM 850 MHz and 1900 MHz Support to Create
Dual-Mode, Quad-Band GSM Transceiver & UMTS Transmitter for MSM6250 Chipset -
SAN DIEGO, Dec. 17 -
QUALCOMM Incorporated (Nasdaq: QCOM), pioneer and world leader of Code
Division Multiple Access (CDMA) digital wireless technology, today announced
the radioOne(TM) RTR6250(TM) chip, a fully integrated transceiver/transmitter
for UMTS (WCDMA) and GSM systems. The RTR6250 device, which features radioOne
Zero Intermediate Frequency (Zero IF) architecture, interfaces directly with
QUALCOMM's MSM6250(TM) Mobile Station Modem (MSM(TM)) baseband processor and
supports dual-mode, quad-band GSM transceiver operations [GSM 900, Digital
Cellular System (DCS) 1800, and GSM 850 and 1900] and UMTS transmit operations
for 1900 MHz and 2100 MHz.
"By adding GSM 850 and 1900 MHz capabilities to the RTR6200 chip, the
RTR6250 chip will help enable worldwide UMTS and GSM roaming," said Don
Schrock, president of QUALCOMM CDMA Technologies. "This increases the already
high level of integration that the RTR6200 device enabled, and will enhance
the cost-effective 3G solution that QUALCOMM offers to manufacturers of
handsets for the UMTS and GSM marketplace."
QUALCOMM's radioOne ZIF architecture eliminates the need for IF components
-- including IF chipsets, IF Surface Acoustic Wave (SAW) filters and IF
voltage controlled oscillators (VCOs) -- thereby reducing printed-circuit-
board area and bill-of-material costs for future wireless handsets and other
devices, enabling more cost-effective multimode, multiband phones.
The RTR6250 GSM receivers consist of LNAs, direct conversion mixers and
filtering, while the GSM transmitters consist of an upconversion modulator and
offset phase locked loop (PLL). The RTR6250 UMTS transmitter includes the I/Q
upconversion modulator, UHF PLLs and a transmit VCO.
The UMTS receive function in the MSM6250 chipset, performed by the RFL6200
LNA and the RFR6200 chip, contains the direct conversion mixer and local
oscillator (LO) generator.
The RTR6250 chip is fabricated with a silicon germanium (SiGe) bipolar
complementary metal oxide semiconductor (BiCMOS) process, thus permitting high
linearity and low power consumption, and is available in an 8X8 mm bump chip
carrier 56-pin Quad Flat No-Lead (QFN) package.
The MSM6250 chipset solution supports data rates of up to 384 kbps and is
compatible with the advanced feature set of QUALCOMM's Launchpad(TM) suite of
technologies, including MPEG-4 video encoding/decoding, fast JPEG
encoding/decoding, MP3 audio decoding, a 2D/3D graphics accelerator for
advanced gaming applications, a MIDI synthesizer and a megapixel digital
camera interface.
Samples of the RTR6250 chipset are expected to be available in the third
quarter of calendar 2003.
QUALCOMM Incorporated ( www.qualcomm.com ) is a leader in developing and
delivering innovative digital wireless communications products and services
based on the Company's CDMA digital technology. Headquartered in San Diego,
Calif., QUALCOMM is included in the S&P 500 Index and traded on The Nasdaq
Stock Market(R) under the ticker symbol QCOM.
Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and have
manufactured significant quantities of CDMA components on a timely and
profitable basis, the extent and speed to which CDMA is deployed, change in
economic conditions of the various markets the Company serves, as well as the
other risks detailed from time to time in the Company's SEC reports, including
the report on Form 10-K for the year ended September 30, 2002 and most recent
Form 10-Q.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. RTR6250,
RTR6200, MSM6250, MSM, radioOne and Launchpad are trademarks of QUALCOMM
Incorporated. All other trademarks are the property of their respective
owners.
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