|
Newsletters
|
|
|
|
|
Wireless Developer Network - Daily News
View Today's WirelessDeveloper NewsWire
Today's News |
WirelessDevNet DevZones |
Yesterday's News |
Submit News |
News-"wireless" Top Stories! |
Around-The-Web
| Wireless DevZones!
QUALCOMM Announces Highly Integrated Dual-CPU Single Chip Solutions for High-Performance Multimedia Wireless Devices
MSM7xxx Family to Drive Lower Overall Systems Cost for Advanced 3G Multimode
Devices Worldwide
SAN DIEGO, May 22 -
QUALCOMM Incorporated (Nasdaq: QCOM), pioneer and world leader of Code
Division Multiple Access (CDMA) digital wireless technology, today announced a
new generation of powerful dual-Central Processing Unit (CPU) single chip
solutions -- the 7xxx family -- to address the growing need for more cost-
effective, high-performance solutions that drive full-featured third-
generation (3G) multimedia handsets for consumers and high data rate devices
for enterprise customers. In designing the MSM7xxx family, QUALCOMM has
brought together its core strengths in wireless chipset design; modem, CPU and
Digital Signal Processor (DSP) expertise; system software and highly
integrated applications engines for future 3G wireless products.
Samples of chipsets in this series are expected to ship in 2004.
"The 7xxx series addresses the growing consumer demand for higher-
performance wireless devices delivering high-quality audio-visual and 2D/3D
gaming, as well as the emerging wireless enterprise data market," said Sanjay
Jha, president of QUALCOMM CDMA Technologies. "This new family of complete
solutions ensures reduced design and development times, stimulating a greater
number of affordable, high-end devices to spur mass-market adoption of
wireless data services."
Each MSM7xxx chip incorporates a dual-CPU architecture with one processor
optimized for multimode modems and time-critical functions, and the second
available as a closely-coupled general purpose processor. The various
multimode chipsets in the MSM7xxx family support deployed 3G wireless
standards, including CDMA2000(R) 1X/1xEV-DO and WCDMA (UMTS) modes, and are
fully compatible with GPRS, GSM and IS-95 standards. New modem technologies
supported by this series are CDMA2000 Revision D, High-Speed Downlink Packet
Access (HSDPA), 802.11 and integrated GPS.
The MSM7xxx family provides the most effective system solution for full-
function CDMA terminals, providing superior optimization of power, cost and
performance. This highly integrated new architecture enables design of higher
performance wireless handsets for mainstream acceptance, while at the same
time keeping overall cost and power requirements to a minimum.
In each MSM7xxx solution, the general purpose processor supports the high-
performance multimedia application engines that run on high-resolution
displays and easily integrates with QUALCOMM's Binary Runtime Environment for
Wireless(TM) (BREW(TM)) application environment and third party operating
systems. With the BREW routines, protocols and tools, handset manufacturers
and developers can create embedded wireless applications and BREW-based
products more quickly and easily.
As with the MSM6xxx family, this new generation of chipset solutions also
supports QUALCOMM's radioOne(TM) Zero Intermediate Frequency (ZIF)
architecture, providing reduced bill of materials and more cost-effective
solutions for multimode, multiband 3G wireless devices.
Key features of the MSM7xxx series of complete solutions include:
* An integrated applications processor featuring an ARM11, delivering
applications processing speeds ranging from 300 MHz to 1 GHz, and a
new generation of QUALCOMM's high-speed, multi-MAC QDSP5000(TM)
Digital Signal Processor
* A low power consumption multimode modem, featuring an ARM9 processor
and dedicated modem hardware
* Very high performance 2D and 3D graphics, and video encode and decode
support
* Large-format, high-resolution Quarter Video Graphics Array (QVGA) and
Video Graphics Array (VGA) displays
* Support for high levels of security for e-commerce and enterprise
applications
* High speed, low power serial interface, Mobile Display Digital
Interface (MDDI), optimizing the interconnection between the MSM and
the LCD panel as well as supporting capabilities such as driving a
PowerPoint on an external display or a video projector from a handset.
* Support for a faster, lower cost memory subsystem
QUALCOMM's MSM7xxx family supports the advanced feature set of QUALCOMM's
Launchpad(TM) suite of application components and software, encompassing
advanced multimedia, connectivity, position location, user interface and
removable storage capabilities.
QUALCOMM today also announced three new MSM6xxx family solutions -- the
MSM6025(TM) chipset solution addressing demand for data-enabled, entry-level
CDMA2000 1X devices; the MSM6700(TM) CDMA2000 1X Revision D chipset and system
software; and the MSM6275(TM) solution to support HSDPA, a next-generation
feature of the WCDMA (UMTS) standard.
With the MSM7xxx family and the three new MSM6xxx family chipsets,
QUALCOMM continues to drive the industry in providing complete, fully-
segmented and cost-effective CDMA solutions. Together with the existing
MSM6xxx family, QUALCOMM's extensive product portfolio for high-, mid- and
entry-level markets meets the global requirements from manufacturers and
operators for continuous creation and improvement of new wireless devices and
services.
QUALCOMM Incorporated ( www.qualcomm.com ) is a leader in developing and
delivering innovative digital wireless communications products and services
based on the Company's CDMA digital technology. Headquartered in San Diego,
Calif., QUALCOMM is included in the S&P 500 Index and is a 2003 FORTUNE 500(R)
company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.
|
|
|
|
