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WirelessDevNet.com Press Release
RFIC's WLAN PA Was Adopted by HP
TAIPEI, Taiwan, July 20 -- RF Integrated Corp. (RFIC), a leading Wireless RF component manufacturer today announced that 802.11b WLAN power amplifier - AP1092 was picked by HP and will be packaged with TI chipsets for making HP's new smartphone h6300, the first consumer model smartphone with three wireless technologies of GSM/GPRS, 802.11b Wi-Fi and Bluetooth 1.1 in one package.
This new HP smartphoone will be released in U.S. soon for it had already been approved by FCC. According to RFIC, AP1092 is a linear, low current power amplifier in ISM band using InGaP/GaAs HBT process. High quality and the special feature of low current of AP1092 have been known by the world RF components industry for its time-to-market advantage. Now RFIC has even developed an upgraded version of AP1092 to focus on increasing the overall efficiency for 11b/g.
AP1098, the enhanced model of AP1092, an 802.11b/g WLAN PA, in fact is the world's most efficient WLAN PA. It has not only been proven having the lowest current worldwide, but is greatly ideal to be used for WLAN handheld devices such as PDA and laptop computers which often require long hours of use unplugged.
According to RFIC, AP1098 can deliver ~19dBm of 802.11g linear power at 3.3v with current only of 85mA and PAE ~28%. The advantage of AP1098 is its high efficiency which enables the transceiver to lower its power burden for achieving greater power level yet consuming less overall current.
Another innovative feature that AP1098 offers, according to RFIC, it is perfect to be used for Bluetooth Class 1 products which have had ever increasing market demand. These products are like Bluetooth PDA and USB Dongles for communicating with other Bluetooth devices in a longer range. Not only AP1098, RFIC lately presented two more new PAs which are drawing many potential customers' attention for their distinguished features. Its new 802.11a 5GHz PA, AP2085, is a linear, three-stage power amplifier MMIC in the 5GHz (4.9~5.85GHz) full band utilizing InGaP/GaAs HBT process. One of AP2085's characteristics is that its gain and power flatness were maintained in the full 4.9~5.85GHz range. Having shown a high linearity performance, AP2085 is capable to deliver ~ 18dBm linear output power for EVM<3%, 30dB gain under 54Mbps OFDM (IEEE802.11a) modulation and it can deliver linear power ~20dBm at 5V.
Another newly released PA is AP1093, the upgraded version of AP1091, it is a mid-high power PA which can be used in both client and access point applications. AP1093 is able to deliver ~19dBm of 802.11g linear power at 3.3V with current only 130mA. In addition, AP1093 can fully deliver ~22dBm of 11g linear power at 5V with current only 180mA.
The CEO of RFIC, Dr. Tan-Hua Yu, expressed her confidence in the line of WLAN products which had already been shipped over 3 million parts so far this year. Yu said, RFIC is ambitious in expanding its product line to the mass market of wireless communications. And RFIC has just successfully developed two advanced CDMA and GSM/GPRS Handset PA and PA modules that are ready to enter the market.
Yu added, RFIC has picked up the right timing to the RF IC market and has completed the synchronization process within the company. She expects RFIC to retain favorable performance and create more fruitful return in the later half of this year.
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