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WirelessDevNet.com Press Release
QUALCOMM & TSMC Collaborate on 90nm Low-Power Process for Wireless Applications
SAN DIEGO, QUALCOMM Incorporated
(Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access
(CDMA) digital wireless technology, and Taiwan Semiconductor Manufacturing
Company Ltd. (TSMC) (NYSE: TSM), the world's largest dedicated semiconductor
foundry, today announced the 2004 delivery of QUALCOMM's first 90 nanometer
(nm) low-power Mobile Station Modem(TM) (MSM(TM)) solutions using TSMC's 90nm
low-power process technology. The new low power and low-k 90nm Nexsys
Technology for SoC(SM) greatly reduces mobile application power consumption,
improves processor performance and enables the integration of more features
onto a single chip.
"We continue to build on the established relationship between QUALCOMM and
TSMC to optimize process technologies for 3G CDMA," said Dr. Sanjay K. Jha,
president of QUALCOMM CDMA Technologies. "At QUALCOMM, we're committed to
leading the wireless industry, and TSMC's Nexsys 90nm process provides our
customers with a path to greater integration and improved performance for
their wireless products."
"We've worked with QUALCOMM for several years on process advancements and
process development for wireless applications. As a strategic partner,
QUALCOMM has access to our advanced process and R&D capabilities," said Rick
Tsai, president of TSMC. "This latest collaboration combines the best of our
foundry process development expertise and our world class manufacturing
capabilities with QUALCOMM's systems technology knowledge and design
expertise."
Production of QUALCOMM's products using TSMC's Nexsys 90nm process for
wireless begins with the MSM6xxx(TM) family. In addition, the MSM7xxx(TM)
family will be targeted first to TSMC's 90nm process and will continue to
evolve to more advanced process technologies. QUALCOMM's Mobile Station Modem
(MSM) family of chipsets provides handset manufacturers with a portfolio of
solutions to address next-generation 3G handsets. These chipsets support
major third-generation (3G) and second-generation (2G) worldwide wireless
standards, and enable high-resolution multimedia applications, including
video, audio, graphics and enhanced 3D animation. The MSM chipsets are highly
integrated, single-chip solutions that offer increased processing capacity
combined with lower power consumption, resulting in an enhanced user
experience.
TSMC's Nexsys 90nm low-k technology for system-on-chip (SoC) design
features the industry's first full 90nm design system, including the
industry's most extensive portfolio of silicon-proven IP and libraries and the
industry's first complete design flow that responds specifically to nanometer
design challenges.
The Nexsys 90nm logic family includes the general-purpose process (G) as
well as low-power (LP) and high-speed (HS) options. Each supports multiple Vt
options for improved power/speed/leakage tradeoffs. TSMC's Nexsys 90nm
technology is deployed in TSMC Fab 12, the industry's largest 300mm production
facility. It is also expected to be deployed in TSMC Fab 14 when the facility
is ramped for production.
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry industry's largest
portfolio of process-proven library, IP, design tools and reference flows.
The company operates one advanced 300mm wafer fab, five eight-inch fabs and
one six-inch wafer fab. TSMC also has substantial capacity commitments at its
wholly-owned subsidiary, WaferTech, and its joint venture fab, SSMC. In early
2001, TSMC became the first IC manufacturer to announce a 90-nm technology
alignment program with its customers. TSMC's corporate headquarters are in
Hsinchu, Taiwan. For more information about TSMC please see
http://www.tsmc.com .
QUALCOMM Incorporated ( www.qualcomm.com ) is a leader in developing and
delivering innovative digital wireless communications products and services
based on the Company's CDMA digital technology. Headquartered in San Diego,
Calif., QUALCOMM is included in the S&P 500 Index and is a 2003 FORTUNE 500(R)
company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.
Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and have
manufactured significant quantities of CDMA components on a timely and
profitable basis, the extent and speed to which CDMA is deployed, change in
economic conditions of the various markets the Company serves, as well as the
other risks detailed from time to time in the Company's SEC reports, including
the report on Form 10-K for the year ended September 28, 2003, and most recent
Form 10-Q.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. MSM, Mobile
Station Modem, MSM6xxx, and MSM7xxx are trademarks of QUALCOMM Incorporated.
All other trademarks and service marks are the property of their respective
owners.
For further information please contact: Jennifer Bernas, QUALCOMM CDMA
Technologies, +1-858-845-7571, qct_publicrelations@qualcomm.com, or Emily Gin,
Corporate Public Relations, +1-858-651-4084, publicrelations@qualcomm.com, or
Bill Davidson, Investor Relations, +1-858-658-4813, ir@qualcomm.com, all of
QUALCOMM Incorporated; or Daniel Holden of TSMC North America,
+1-408-382-7921, dholden@tsmc.com
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