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WirelessDevNet.com Press Release
Digia Accelerates Smartphone and Operator Service Differentiation on Symbian™ OS and TI's OMAP™
Digia Inc (Digia), the market leader in Symbian™ OS -based software integration services and solutions for smartphones, today published a complete application and differentiation package, Digia®D-Pack, supporting the Texas Instruments Incorporated (TI) OMAP™ application processors.
The announced application package, Digia®D-Pack, is targeted for Symbian OS–based phones running on TI's OMAP platform and brings a further layer for smartphone manufacturers and service operators to differentiate their products and services to the end-customers in an efficient manner.
Digia®D-Pack offers an extensive set of high-quality and production ready applications and software components designed especially to enrich the Symbian OS –based smartphone functionality. By using Digia®D-Pack, handset manufacturers and service providers will be able to tailor various communication experiences and services for their end-customers in the areas of rich messaging, imaging, audio and graphics with seamless end-user experience and design.
Digia's offering is shaping the future of mobile devices – from the design of the devices to the exciting applications and services that run on them. As a Symbian Competence Center, Series 60 Platform Competence Center and TI OMAP Technology Center, Digia supports the TI's offering by acting as a complete software solution provider and systems integrator for the common handset manufacturer customers utilizing the TI OMAP™ platform.
Mrs Inka Luotola, Vice President, Sales and Marketing of Digia, said: "Digia illustrates its extensive competence in Symbian OS and Series 60 platforms by providing software solutions like Digia®D-Pack with optimized performance and verified quality. We truly value our partnership with Texas Instruments -by collaborating towards our common OEM and operator customers, we together enable faster time-to-market and better differentiation of Symbian OS based phones and services."
"Digia has been a valued member of TI's Independent OMAP Technology Center network since its inception. Digia's smartphone integration services and advanced software solutions supporting the OMAP platform, such as Digia®D-Pack, offer quick time to market with value added applications for handset manufacturers and operators," said Mr. Paul Werp, TI worldwide director of marketing, Cellular Systems.
For more information, please contact:
Inka Luotola, VP Sales & Marketing, Digia Inc.
Tel. +358 40 5040605, e-mail: inka.luotola@digia.com
Wolfgang Kölbl, D-Pack Product Manager, Digia Inc.
Tel +358 40 5392 265 wolfgang.kolbl@digia.com
About Digia:
Digia is a leading Smartphone Systems Integrator serving handset and hardware manufacturers, and service providers globally. Digia offers its customers qualified contract engineering services and technology solutions for smartphones as well as software platform creation and development. For more information: www.digia.com
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