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WirelessDevNet.com Press Release
TriQuint Semiconductor Unveils New Industry-Leading Wireless Handset Front-End Module Products
HILLSBORO, Ore.-- TriQuint Semiconductor (Nasdaq: TQNT), a leading manufacturer of RF front-end modules (FEMs) for wireless handsets, today unveiled details of its new product portfolio offering ultra-compact, high performance integrated system solutions for GSM / GPRS / EDGE, WCDMA and CDMA standards. TriQuint’s new products will debut at the GSM World Congress in Barcelona, Spain (12th-15th Feb 2007) and support its ‘Global Handset Strategy’ announced February 1st. The new, fully-optimized modules are created in concert with the world’s largest transceiver and handset manufacturers, offering industry-leading integration, performance and size-reduction.
TriQuint President and CEO Ralph Quinsey remarked that new members of GSM/EDGE, 3G WEDGE and CDMA product lines to be introduced at the 2007 GSM World Congress, will for the first time be branded into families. Like all of the company’s handset products, TriQuint’s new modules are designed to increase efficiency for extended talk-time, speed time-to-market and save RF front-end PC board space to enable the addition of multimedia and connectivity features in sleek, ergonomic mobile phones that consumers strongly favor.
“The company’s products are unique in their ability to economize on space while improving performance. It is from physics that we derived the new family names of HADRON, TRITIUM and QUANTUM – a natural expression of key product characteristics: fundamental building blocks on which the greater-whole is based; small in size; and efficient power generation at high speed,” said Shane Smith, TriQuint Director of Handset Product Marketing.
TriQuint’s HADRON PA ModuleTM family is an industry standard 7x7x1.1mm3 series of discrete PA modules that provide customers with a choice between EDGE-Linear and EDGE-Polar architectures. Both solutions are optimized to deliver the best possible talk time in GSM/GPRS and EDGE (8PSK) modes. TriQuint’s HADRON II PA ModuleTM family is a new generation shrinking the form factor to 5x5x1.1mm3.
TriQuint’s new TRITIUM PA-Duplexer ModuleTM family includes versions that support both CDMA and WCDMA/HSDPA applications with 8x5x1.5mm3 modules integrating a duplexer and Tx interstage filter with a linear power amplifier – each optimized to major global geographic frequency bands. TriQuint’s TRITIUM II PA-Duplexer ModuleTM family is a new generation, shrinking the form factor to 7x4x1.2mm3.
The QUANTUM Tx ModuleTM family builds on the heritage of TriQuint’s signature GSM/GPRS transmit modules integrating a GaAs pHEMT switch, low pass filters and a power amplifier along with all necessary matching/control circuits. The QUANTUM family now adds a full-featured quad-band EDGE-Linear version, and in support of its 2007 ‘Global Handset Strategy’, a dual-band GSM/GPRS version for emerging entry-level markets. TriQuint’s new QUANTUM II Tx ModuleTM family adds a WEDGE compatible multi-throw switch. QUANTUM plus TRITIUM modules provide a path to a complete, ultra-compact system solution for 3G WEDGE applications. All three families include ESD protection circuitry and are RoHS compliant.
TriQuint’s newest HADRON, TRITIUM and QUANTUM modules complement a full line of GSM / EDGE and WCDMA products for current and next-generation wireless handsets as well as Bluetooth® PAs and filters. See TriQuint’s newest modules at the company’s GSM World Congress exhibition (Hall 2, Level 1, Space D22) in Barcelona, Spain (12th-15th February 2007), or request further information at this e-mail address: info@tqs.com. The GSM World Congress is the largest convention and exhibition dedicated to GSM wireless communications, now with more than 2.6 billion global subscribers
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