Intel Introduces World's Highest Performance Flash Memory for Internet-Enabled Cell Phones

TOKYO, April 17, 2002-- Intel Discusses Innovative Flash Memory Packaging Techniques at Intel Developer Forum in Japan

Intel Corporation today introduced the world's highest performance flash memory for cell phones and detailed innovative flash memory packaging techniques.

The Intel(R) 1.8 Volt Wireless Flash memory is built on Intel's industry-leading 0.13 micron process technology and is up to four times faster than existing flash solutions. This increased performance results in higher data throughput rates that speed up data-intensive Internet phone applications such as browsing, streaming multimedia and text messaging. The new chip also consumes less power than standard flash chips, resulting in extended battery life.

"Flash memory plays a vital role in Internet-enabled phones," said Ron Smith, senior vice president and general manager of Intel's Wireless Communications and Computing Group, at the Intel Developer Forum (IDF). "As more data-intensive Internet applications are operated on cell phones, higher densities of high-performance, low-power flash memory are required, and Intel is leading the charge to produce them."

The Science of Flash Packaging

Intel also disclosed innovative flash memory packaging techniques at IDF that will enable high-performance memory in smaller cell phones. These techniques include stacking multiple, high-density memory and memory-logic chips in a single package, and stacking folded packages that accommodate higher levels of multi-die integration and memory density in a smaller space. Packaging techniques are crucial in a small form factor device such as a cell phone, where higher levels of memory are required but board space is at a minimum. Intel will begin sampling flash memory using this folded and stacked packaging technique later this year. "In addition to manufacturing flash at 0.13 micron that is one product generation ahead of our competitors, Intel, the leading flash supplier, also provides world-class packaging solutions from single die to integrated multi-die subsystems," said Darin Billerbeck, vice president of Intel's Wireless Communications and Computing Group and general manager of Intel's Flash Products Group.

Wireless Devices: Anywhere, Anytime

Intel's wireless products are built around three core technologies: Intel Wireless Flash memory, the Intel(R) XScale(TM) microarchitecture for applications processing and the Intel(R) Micro Signal Architecture for signal processing. These technologies are optimized for higher performance and lower power consumption for users of wireless devices and are the key ingredients of the Intel(R) Personal Internet Client Architecture, Intel's development blueprint for designing wireless handheld communication products that combine voice communications and Internet access capabilities.

Intel 1.8 Volt Wireless Flash Memory: Pricing and Availability

The Intel 1.8 Volt Wireless Flash memory will be available in 64- and 32-Mbit densities. The 64-Mbit density is currently sampling and will be in production in August, while the 32-Mbit density will sample in June and be in production in October. A 128-Mbit density chip will also sample later this year and be in production in 2003. In 10,000- unit quantities, the 64-Mbit density is priced at $14.91, and the 32-Mbit density is priced at $8.97. The chip is currently in production on a 0.18 micron version in all three densities.

About IDF

The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com.

CONTACT:
Intel
Daniel J. Francisco, 916/356-0546
daniel.j.francisco@intel.com

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